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AddOn 16GB DDR3 SDRAM Memory Module, 1600MHz Unbuffered, 204-pin SoDIMM, CL11, 1.35V, Compatible with Server/Notebook/Desktop PC – AA160D3SL/16G

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  • 16GB DDR3 SDRAM Memory Module

  • 1600 MHz Memory Speed

  • 1.35V Low Voltage Operation

  • Unbuffered Signal Processing

  • CL11 Latency

  • 204-pin SoDIMM Form Factor

  • Compatible with Server, Notebook, and Desktop PC

  • 100% OEM Compatible

  • Meets JEDEC Standards

AED1,899.00

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High-Capacity DDR3 Memory with Advanced Heat Management

The 16GB DDR3 SODIMM module features an optimized layout of eight memory chips arranged in a dual-rank configuration. The strategic placement of components on the green PCB allows for efficient heat dissipation while maintaining high-speed performance at 1600 MHz. The low-profile design ensures compatibility with space-constrained laptop and small form factor systems.
Angled view of 16GB DDR3 SODIMM memory module showing eight memory chips on green PCB

Technical Specifications

  • Dual-rank architecture for optimal performance
  • Low-voltage 1.35V operation for energy efficiency
  • 204-pin SODIMM form factor for laptop compatibility

Applications

  • Enterprise laptop memory upgrades
  • Mobile workstation performance enhancement
  • Small form factor system optimization

Enterprise-Grade Memory Architecture

The module’s front view highlights the precision-engineered component layout that delivers reliable performance for business systems. Each memory chip is precisely positioned to ensure optimal signal integrity at high speeds. The gold-plated edge connectors provide dependable electrical contact for long-term reliability in mission-critical environments.
Front view of DDR3 SODIMM module showing symmetrical memory chip arrangement and gold contacts

Technical Specifications

  • Gold-plated contacts for superior conductivity
  • Symmetrical chip layout for signal integrity
  • JEDEC-standard PCB design

Applications

  • Data center server memory expansion
  • Professional workstation upgrades
  • High-performance computing applications

Precision-Engineered Memory Module Design

This angled perspective showcases the module’s sophisticated dual-rank architecture and premium component selection. The carefully orchestrated layout of memory ICs ensures consistent performance while maintaining thermal efficiency. Each component is precisely soldered to meet strict quality standards for enterprise deployments.
Angled perspective of DDR3 SODIMM showing memory chip arrangement and circuit traces

Technical Specifications

  • Industrial-grade component selection
  • Optimized trace routing for signal quality
  • Enhanced thermal management design

Applications

  • Critical infrastructure systems
  • Industrial computing platforms
  • 24/7 operation environments

Component-Level Engineering Excellence

A detailed view of the memory module’s core components reveals the attention to manufacturing precision. The uniform spacing between chips and consistent solder joints demonstrate the high-quality assembly process. This level of detail ensures reliable operation in demanding enterprise environments.
Close-up view of DDR3 SODIMM memory chips and circuit board assembly

Technical Specifications

  • Precision automated assembly
  • Quality-controlled solder joints
  • Consistent chip spacing for thermal balance

Applications

  • Financial computing systems
  • Healthcare equipment
  • Telecommunications infrastructure

Advanced Thermal Design Implementation

The module’s thermal design philosophy is evident in this perspective, showing the strategic component placement that facilitates natural heat dissipation. The layout optimizes airflow around critical components while maintaining high-speed signal integrity. This approach ensures stable performance under heavy workloads.
Perspective view of DDR3 SODIMM highlighting thermal design and component layout

Technical Specifications

  • Optimized component spacing for cooling
  • Heat-dissipating PCB design
  • Temperature-resistant materials

Applications

  • High-density server environments
  • Compact industrial systems
  • Performance computing applications

Signal Integrity Optimization

This view emphasizes the module’s electrical design excellence, showcasing the precise routing of signal traces and ground planes. The careful attention to signal path design ensures reliable data transmission at high speeds while minimizing electromagnetic interference. Each component placement is optimized for maximum signal quality.
Horizontal view of DDR3 SODIMM showing signal trace layout and component positioning

Technical Specifications

  • Controlled impedance trace design
  • EMI-optimized layout
  • High-speed signal path optimization

Applications

  • Mission-critical servers
  • High-frequency trading systems
  • Data processing centers

Reliability-Focused Architecture

The memory module’s architecture emphasizes long-term reliability through careful component selection and layout. Each element is positioned to ensure optimal electrical performance while maintaining thermal efficiency. The design supports consistent operation in demanding enterprise environments.
Angled view of DDR3 SODIMM emphasizing architectural design and component placement

Technical Specifications

  • Enterprise-grade component selection
  • Reliability-tested architecture
  • Optimized power delivery design

Applications

  • Long-term deployment systems
  • Critical infrastructure servers
  • Enterprise data centers

ManufacturingPrecisionDetails

A detailed examination of the manufacturing quality is visible in this close-up view. The precise alignment of components and consistent solder joints demonstrate the high manufacturing standards. Each element is positioned with exacting tolerance to ensure reliable performance in enterprise applications.
Close-up detail of DDR3 SODIMM showing manufacturing precision and component quality

Technical Specifications

  • Precision assembly tolerances
  • Quality-controlled manufacturing
  • Consistent component placement

Applications

  • Quality-critical applications
  • High-reliability systems
  • Enterprise computing platforms
SKU: AA160D3SL/16G Category: Tag:

General Information
Manufacturer: AddOn
Manufacturer Part Number: AA160D3SL/16G
Brand Name: AddOn
Product Name: 16GB DDR3 SDRAM Memory Module
Packaged Quantity: 1
Product Type: RAM Module

Technical Information
Memory Size: 16 GB
Memory Technology: DDR3 SDRAM
Memory Voltage: 1.35 V
Number of Modules: 1 x 16GB
Memory Speed: 1600 MHz
Signal Processing: Unbuffered
CAS Latency: CL11
Device Supported: Server, Notebook, Desktop PC

Physical Characteristics
Number of Pins: 204-pin
Form Factor: SoDIMM

Miscellaneous
Compatibility:

HP Products:
250 G4 Notebook, 255 G4 Notebook, 280 G1 MT (P0C86UT#ABA, P0C87UT#ABA, P0C88UT#ABA), Elite Folio 9480m Notebook, EliteBook 725 G2, 745 G2, 755 G2, 840 G2, 850 G1, 850 G2, 8570w (C6Y87UT#ABA), 8740W (WH276UT#ABA, WH279UA#ABA), Revolve 810 G3, EliteDesk 705 G1 SFF/MT (J6D02UT#ABA), ProBook 430 G3, 440 G3, 450 G2, 455 G3, 470 G3, 640 G1, 650 G1, ProDesk 280 G1 MT (P5V12UT#ABA), 400 G2 DM (M2V15AV_1, P5U78UT#ABA, P5U80UT#ABA), 400 G2.5 (L9F03UT#ABA), 400 G2.5 SFF (P0D14UT#ABA), Pro 6300 Business PC (B0F50EA).

Intel Products:
NUC Kit DE3815TYKHE, NUC Kit NUC5I7RYH.

Dell Products:
Optiplex 790 MT/DT/SFF, Optiplex 790 USFF, PowerEdge R210, Precision 15 7000 Series (7510), Precision 17 7000 Series (7710), Precision M4500.

Lenovo Products:
ThinkCentre E73 SFF (10AU), E73 Tower (10AS), M53 Tiny (10ED), M600 Tiny (10G9000NUS), M73 Tiny (10AY, 10B6), M73z (10BC), M79 SFF (10JB), M93P Tiny (10AB), ThinkPad 11e (20DA001VUS, 20E6000PUS), ThinkPad E450 (20DC00BYUS), E460 (20ET0011US, 20ET0014US, 20ET0019US), E550 (20DF00EDUS), E560 (20EV002JUS, 20EV002KUS, 20EV002NUS, 20EV), E565 (20EY000AUS, 20EY000CUS), L440 (20AW0049US), M22 (80S60001US), N22 (80S60005US), T440p (20AW0001US, 20AW004DUS), T450 (20BV0001US, 20BV0005US, 20BV000AUS, 20BV000CUS), T460 (20FN002JUS, 20FN002VUS), T560 (20FH001RUS), W541 (20EF000HUS), ThinkServer RD350 (70D6001YUX, 70D60020UX), RD650 (70DR000RUX), RS140 (70F9001MUX).

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