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AMD Ryzen 9 7950X3D Hexadeca-core Desktop Processor, 16 Cores, 32 Threads, 4.2GHz Base/5.7GHz Boost, 128MB L3 Cache, Socket AM5 – 100-000000908

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  • 16-Core AMD Ryzen 9 7950X3D with 32 threads

  • Base clock 4.2GHz, boosts up to 5.7GHz

  • 128MB L3 Cache + 16MB L2 Cache

  • 5nm Process Technology

  • AMD 3D V-Cache Technology for enhanced gaming

  • Socket AM5 compatibility

  • Supports up to 4 monitors with integrated Radeon Graphics

  • 120W Thermal Design Power

  • Maximum temperature: 89°C

  • 3rd Generation Ryzen architecture

AED5,499.00

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Next-Gen Gaming Power in Premium Packaging

The AMD Ryzen 9 7950X3D comes in a striking black and orange retail box that reflects its premium positioning. The distinctive design highlights the revolutionary 3D V-Cache technology while maintaining AMD’s signature aesthetic. The packaging effectively communicates both the processor’s gaming prowess and its position as AMD’s flagship desktop CPU.
AMD Ryzen 9 7950X3D processor retail box featuring black and orange design with 3D V-Cache branding

Technical Specifications

  • 16 cores and 32 threads for ultimate gaming performance
  • Base clock of 4.2GHz with boost up to 5.7GHz
  • Socket AM5 compatibility for future upgrades

Applications

  • High-end gaming with maximum frame rates
  • Content creation and streaming
  • Professional 3D rendering and modeling

Engineering Excellence in Silicon

The processor die showcases AMD’s cutting-edge engineering, with the brushed metal heatspreader featuring precision-etched AMD Ryzen branding. The clean, industrial design reflects the sophisticated technology within, while the premium finish speaks to the processor’s high-end positioning in AMD’s lineup.
Top-down view of AMD Ryzen processor showing brushed metal heatspreader with etched branding

Technical Specifications

  • Precision-engineered heatspreader for optimal thermal transfer
  • 5nm manufacturing process for maximum efficiency
  • Advanced thermal design power management

Applications

  • Extended gaming sessions with stable temperatures
  • Overclocking potential for enthusiasts
  • 24/7 workstation operations

Dynamic Heat Dissipation Design

The angled perspective reveals the sophisticated heat dissipation system of the Ryzen 9 7950X3D. The brushed metal surface and raised edges optimize thermal transfer, ensuring peak performance during intensive workloads.
Angled view of AMD Ryzen 7950X3D processor showing heat spreader design and thermal architecture

Technical Specifications

  • 120W TDP for efficient power management
  • Advanced thermal interface material
  • Optimized heat spreading surface

Applications

  • Sustained gaming performance
  • Heavy multitasking scenarios
  • Intensive computational tasks

Precision Engineering at Every Angle

This perspective highlights the meticulously crafted corners and edges of the processor, showcasing the attention to detail in AMD’s manufacturing process. The seamless integration of the heatspreader with the substrate demonstrates superior build quality.
Detailed view of AMD Ryzen processor corner design and edge finishing

Technical Specifications

  • Precision-cut corners for optimal fit
  • Military-grade materials
  • Premium surface finishing

Applications

  • Professional gaming setups
  • Custom PC builds
  • Enterprise workstations

Advanced Thermal Architecture

The processor’s thermal design comes into focus, showing the sophisticated heat management system. The integrated heat spreader features a precisely engineered surface that maximizes contact with cooling solutions.
Close-up of AMD Ryzen processor thermal design and heat spreader surface

Technical Specifications

  • Optimized thermal conductivity
  • 192.2°F maximum temperature threshold
  • Enhanced heat dissipation pattern

Applications

  • Extreme gaming sessions
  • Overclocking experiments
  • Continuous workload scenarios

Innovative Circuit Integration

The processor’s substrate reveals the complex integration of power delivery systems and cache architecture. The golden contact points ensure reliable connectivity while the substrate design optimizes signal integrity.
Detailed view of AMD Ryzen processor substrate and circuit layout

Technical Specifications

  • Advanced power delivery system
  • Optimized signal routing
  • High-density circuit design

Applications

  • Low-latency gaming
  • Data center applications
  • High-performance computing

Pin Grid Array Excellence

The intricate pin grid array showcases the processor’s connection interface. Each pin is precisely positioned to ensure optimal electrical contact and signal integrity with the motherboard socket.
Close-up of AMD Ryzen processor pin grid array layout

Technical Specifications

  • LGA socket design
  • High-speed data transfer paths
  • Precision pin alignment

Applications

  • Competitive gaming builds
  • Server deployments
  • Workstation setups

Power Delivery Innovation

The processor’s power delivery system is showcased in this perspective, highlighting the sophisticated voltage regulation and power management capabilities that enable high-performance operation.
View of AMD Ryzen processor power delivery system

Technical Specifications

  • Advanced power phase design
  • Efficient voltage regulation
  • Thermal-aware power management

Applications

  • Performance gaming
  •  Professional workloads
  • 24/7 operation scenarios

Circuit Integration Mastery

The processor’s circuit integration is displayed from another angle, showing the intricate routing and component placement that enables high-speed operation and efficient power delivery.
Angled view of AMD Ryzen processor circuit integration

Technical Specifications

  • High-density circuit layout
  • Optimized signal paths
  • Premium component selection

Applications

  • Competitive gaming
  • Multi-threaded applications
  • Enterprise computing

Thermal Solution Integration

The final perspective emphasizes the processor’s thermal solution integration capabilities, showing how the design accommodates various cooling solutions while maintaining optimal heat dissipation.
View of AMD Ryzen processor thermal solution integration

Technical Specifications

  • Cooling solution compatibility
  • Thermal interface optimization
  • Heat spreader efficiency

Applications

  • Extended gaming marathons
  • Rendering workstations
  • High-performance servers
SKU: 100000000908 Category: Tag:

General Information
Manufacturer: Advanced Micro Devices, Inc
Manufacturer Part Number: 100000000908
Brand Name: AMD
Product Line: Ryzen 9
Product Series: 7000
Product Model: 7950X3D
Product Name: Ryzen 9 Hexadeca-core (16 Core) 7950X3D 4.2GHz Desktop Processor
Package Type: OEM
Product Type: Processor

Technical Information
Processor Manufacturer: AMD
Processor Core: Hexadeca-core (16 Core)
Clock Speed: 4.20 GHz
Overclocking Speed: 5.70 GHz
L2 Cache: 16 MB
L3 Cache: 128 MB
64-bit Processing: Yes
Process Technology: 5 nm
Processor Threads: 32
Processor Socket: Socket AM5
Processor Generation: 3rd Gen

Display & Graphics
Graphics Controller Manufacturer: AMD
Graphics Controller Model: Radeon Graphics
Number of Monitors Supported: 4
Integrated Graphics: Yes

Power Description
Thermal Design Power: 120 W

Environmental Conditions
Thermal Specification: 89°C (192.2°F)

Physical Characteristics
Height: 1.6 in
Width: 1.6 in

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