Intel SSDPEDMD020T401 / Dell CJY9F 2TB 1/2 Height DC P3700 Series PCIe 3.0 SSD

Intel SSDPEDMD020T401 / Dell CJY9F 2TB 1/2 Height DC P3700 Series PCIe 3.0 SSD – Brand New

Intel SSDPEDMD020T401 / Dell CJY9F 2TB 1/2 Height DC P3700 Series PCIe 3.0 SSD – Brand New

Intel Model Number: SSDPEDMD020T4
Alt. Ordering Part Number:  403-BBHU SSDPEDMD020T401, CJY9F, 0CJY9F

Intel SSD Data Center Family for PCIe P3700 provides breakthrough performance to modernize data center storage from an industry leader.
Intel P3700 brings extreme data throughput directly to Xeon processors with up to six times faster data transfer speed than 6 Gbps SAS/SATA SSDs1. The performance of a single drive from DC P3700 Series (460K IOPS), can replace the performance of 7 SATA SSDs aggregated through an HBA (500K IOPS). At 200 IOPS per Hard Disk Drive (HDD), 2,300 15K HDDs would be needed to match the performance of one these drives. Consistently amazing performance provides fast, unwavering data streams directly to Intel Xeon processors making server data transfers efficient. SSD performance consistency provides scalable throughput when multiple SSDs are unified into a single storage volume. The massive storage bandwidth increase feeds Intel Xeon processor systems giving data center servers a performance boost. Servers can now support more users simultaneously, compute on larger data sets, and address high-performance computing at lower Total Cost of Ownership (TCO). Intel led the industry in creation of a new Non-Volatile Memory Express (NV ME) storage interface standard. NV ME is engineered for current and future NVMe technologies, unlike SAS/SATA SSDs. NV ME overcomes SAS/SATA SSD performance limitations by optimizing hardware and software to take full advantage of NVM SSD technology. Intel Xeon processors efficiently transfer data in fewer clock cycles with the NV ME optimized software stack compared to the legacy Advance Host Controller Interface (AHCI) stack, reducing latency and overhead. Direct CPU connection also eliminates Host-Bus-Adapter (HBA) cards, further reducing latency and TCO. The new 2.5″ form-factor with hot-swap capability provides convenient front panel serviceability allowing quick, uninterrupted installation. The AIC form-factor conveniently fits in half-height, half-length slots.